Conductive Inkjet Technology has developed a revolutionary two-step process to create solid copper circuitry directly from digital files. The process patterns a catalytic ink and then immerses the image in an electroless plating solution to deposit solid metal onto the desired pattern.
Because the process additively builds circuits, ink and metal are only deposited where required by the design. The result is a significantly smaller waste stream and environmental footprint relative to traditional circuit fabrication processes.